Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be ...

CHARLOTTE, N.C. — The IC design and test community's quest to achieve fewer than 100 defective parts per million (DPPM) is becoming more difficult as process technologies move below 100 nanometers.

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

With the increasing prevalence and complexity of automotive electronics (see figure below), there is increasing pressure to move the reliability level of electronic components and systems to an ...

He helped in aligning business requirements with technical solutions, to address automation challenges collectively. This ...